Dentsply Sirona Prime&Bond XP Mode D'emploi page 11

Light curing note.
Light curing of applied Prime&Bond
sary when used in conjunction with Dentsply Sirona manufactured dual cure resin
cement. If curing is desired, cure mixed adhesive/activator for 10 seconds** using a
curing light.
3.6.5 Cementation
1. Prepare and apply dual cured resin cement, according to manufacturer's instructions.
3.7 Endodontic post cementation
3.7.1 Cleaning
1. See section 3.1.1 Cleaning.
3.7.2 Tooth conditioning/dentin pre-treatment
1. Rinse and thoroughly dry the prepared post preparation space (using air and paper points).
2. Attach disposable needle to end of syringe. Needle tip may be bent for easy access.
3. Gently extrude respective 34%-36% conditioner to the post space and maintain contact for 15
seconds followed by a 15-second rinse.
4. The preparation post space should then be dried with a gentle air blast and paper points to
remove residual moisture, but do not desiccate the conditioned dentin surface.
5. Once the surfaces have been properly treated, they must be kept uncontaminated.
6. If salivary contamination occurs, repeat procedure beginning at step 3.7.1.
3.7.3 Application
1. Place 1-2 drops of Prime&Bond
plastic mixing well. Replace cap promptly.
2. Place an equal number of drops of Self Cure Activator into the same mixing well. Replace cap
promptly. Mix contents for 1-2 seconds with a clean, unused brush tip.
3. Apply mixed adhesive/activator to post preparation with the brush provided, being sure to apply
generous amounts to the preparation orifice. A paper point prewetted with the adhesive mixture
may aid in bringing the adhesive mixture down to the deepest portion of the preparation. Avoid
pooling. Maintain contact of adhesive/activator with tooth structure for at least 20 seconds.
4. Remove solvent by gently drying with clean, dry air from a dental syringe for at least 5 sec-
onds. Surface should have a uniform glossy appearance. If not, repeat application and air dry.
Surface should not show areas of excessive adhesive thickness or pooling. Repeat air drying/
evaporation outlined above if necessary. Use of clean, dry paper points may aid in thorough
removal of solvent/excess adhesive in post space.
Light curing note.
Light curing of applied Prime&Bond
sary when used in conjunction with Dentsply Sirona manufactured dual cure resin ce-
ments or restoratives. If curing is desired, cure mixed adhesive/activator for 10 sec-
onds** using a curing light.
** Check curing light for minimum light output of at least 800 mW/cm
between 500 and 800 mW/cm
®
XP adhesive into a clean CliXdish™ mixing well or standard
®
XP adhesive and activator mixture is not neces-
®
.
2
XP adhesive and activator mixture is not neces-
. Cure for at least 20 seconds if light output is
2
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