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Les langues disponibles
Les langues disponibles
USAGE PURPOSE
The device is designed for:
1.
Different kind of soldering, de-soldering of the electronic components such as: SOIC, CHIP, QFP, PLCC, SMD, etc.
especially for BGA modules, motherboards in electronic devices.
2.
Shrinking, paint drying, adhesive removal, thawing, warming, plastic welding.
Any damage resulting from a non-conform use of the device is payable by the user!
PRINCIPLE OF OPERATION
Assembly:
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1
1.
SMD rework gun cable
2.
SMD rework gun switch on /off
3.
preheater switch on / off
4.
soldering iron switch on / off
5.
soldering iron connection socket
6.
soldering iron temperature decreasing button
7.
soldering iron temperature increasing button
8.
preheater temperature decreasing button
9.
preheater temperature increasing button
10.
SMD rework gun temperature decreasing button
11.
SMD rework gun temperature increasing button
12.
soldering iron heating indicator
13.
preheater heating indicator
14.
SMD rework gun heating indicator
15.
soldering iron temperature display
16.
preheater temperature display
17.
SMD rework temperature display
18.
airflow volume indicator
19.
airflow volume adjustment knob
BEFORE FIRST USE
Upon receipt of the goods, check the packaging for integrity and open it. If the packaging is damaged, please contact your
transport company and distributor within 3 days, and document the damages as detailed as possible. Do not turn the
package upside down! When transporting the package, please ensure that it is kept horizontal and stable. Please keep all
packaging materials (cardboard, plastic tapes and styrofoam), so that in case of a problem, the device can be sent back to
the service centre in accurate condition.
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