Equipotential Bonding; Instruction For Use - Weller WDD 161V Mode D'emploi

English
precision of the temperature control. To obtain good unsol-
dering results, it is important to clean the unsoldering head
regularly. This includes draining the filler wire collector,
replacing the glass tube filter and checking the seals. Airtight
facing surfaces on the glass cylinder guarantee full suction
potential. Because dirty filters affect the flow of air through
the Unsoldering iron, the main filter (9) (hose filter at vacuum
hose) should be checked regularly and replaced as needed.
Use a new, original Weller filter cartridge. Use the cleaning
tool (T005 13 500 99) to clean the suction nozzle bore and
the suction tube.
The suction nozzles can be replaced quickly and easily with
a short turning movement (approx. 45°).
Large deposits in the area of the cone will prevent the inser-
tion of a new suction nozzle. Deposits can be removed with
the cleaning insert for the heating element cone.
Caution:
Working without a filter will destroy the pneumatic
converter.
Cleaning tool, cleaning process and replacing the
suction nozzles - see page 85.

4. Equipotential bonding

The various circuit elements of the 3.5 mm jack bush (8)
make 4 variations possible:
Hard-grounded:
No plug (delivery form)
Equipotential bonding (impedance 0
ohms):
With plug, equalizer at center contact
Potential free:
With plug
Soft-grounded:
With plug and soldered
resistance.Grounding via set resistance
value.
5. Instructions for use
For initial heating, coat the selective tinnable tip with solder.
This removes any oxidation or dirt on the tip which may have
occurred during storage. During pauses between soldering
and before storing the soldering iron, ensure that the tip of
the soldering iron is well coated. Do not use aggressive flu-
xing agents.
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Note:
Always ensure the proper position of the soldering iron
tip.
These soldering irons have been adjusted for an
average-size tip. Deviations can occur due to exchanging of
the tip or using other tip designs.
Different suction nozzles solve many unsoldering problems.
The suction nozzles can be easily replaced, since the tool is
integrated in the cleaning tool.
It is important to use additional filler wire when unsoldering.
This ensures the good wetting of the suction nozzle and bet-
ter flow properties of the old solder. Care must be taken to
ensure that the suction nozzle is vertical with respect to the
plate in order to obtain the best possible suctioning power.
The solder must be completely liquefied. It is important to
ensure during the unsoldering process that the connecting
pin of the component is moved in a circular motion in the
bore.
If the solder has not been fully removed after the suctioning
process, the soldering location should be tinned before
unsoldering again.
The selection of the correct suction nozzle size is important.
Rule of thumb: internal diameter of the suction nozzle should
correspond to the diameter of the plate bore.
If the total output of the unit is exceeded due to the connec-
ted soldering tools the right channel will switch off automa-
tically.
External input unit WCB 1 and WCB 2 (optional)
The following functions are possible when using an external
input unit.
● Offset:
The real temperature of the soldering iron can be changed by
± 40 °C by input of a temperature offset.
● Setback:
Reduction of the setpoint temperature to 150 °C (standby).
The set backtime can be set at 0-99 minutes after the sol-
dering station has switched to standby mode. After a period
equal to three times the set-back time, the "Auto Off" func-
tion is activated. The soldering iron is switched off (flashing
dash on the display).
● Lock:
Locking the setpoint temperature. Settings cannot be chan-
ged after the soldering station has been locked.
● °C/°F:
Switching the temperature display from °C to °F, and vice
versa.