Equipotential Bonding; Instruction For Use - Weller WDD 161V Mode D'emploi

English
affects the precision of the temperature control.
To obtain good unsoldering results, it is important to
clean the unsoldering head regularly. This includes drai-
ning the filler wire collector, replacing the glass tube fil-
ter and checking the seals. Airtight facing surfaces on the
glass cylinder guarantee full suction potential. Because
dirty filters affect the flow of air through the Unsoldering
iron, the main filter (9) (hose filter at vacuum hose)
should be checked regularly and replaced as needed. Use
a new, original Weller filter cartridge. Use the cleaning
tool (5 13 500 99) to clean the suction nozzle bore and
the suction tube.
The suction nozzles can be replaced quickly and easily
with a short turning movement (approx. 45°).
Large deposits in the area of the cone will prevent the
insertion of a new suction nozzle. Deposits can be remo-
ved with the cleaning insert for the heating element cone.
Caution: Working without a filter will destroy the pneu-
matic converter.
Cleaning tool, cleaning process and replacing the suc-
tion nozzles - see page 84.

4. Equipotential bonding

The various circuit elements of the 3.5 mm jack bush (13)
make 4 variations possible:
Hard-grounded:
No plug (delivery form)
Equipotential bonding (impedance 0 ohms):
With plug, equalizer at center contact
Potential free:
With plug
Soft-grounded:
With plug and soldered resistance.Grounding via set resi-
stance value.
19
5. Instructions for use
For initial heating, coat the selective tinnable tip with sol-
der. This removes any oxidation or dirt on the tip which
may have occurred during storage. During pauses bet-
ween soldering and before storing the soldering iron,
ensure that the tip of the soldering iron is well coated. Do
not use aggressive fluxing agents.
Note: Always ensure the proper position of the soldering
iron tip.
These soldering irons have been adjusted for an average-
size tip. Deviations can occur due to exchanging of the tip
or using other tip designs.
Different suction nozzles solve many unsoldering pro-
blems. The suction nozzles can be easily replaced, since
the tool is integrated in the cleaning tool.
It is important to use additional filler wire when unsolde-
ring. This ensures the good wetting of the suction nozzle
and better flow properties of the old solder. Care must be
taken to ensure that the suction nozzle is vertical with
respect to the plate in order to obtain the best possible
suctioning power. The solder must be completely lique-
fied. It is important to ensure during the unsoldering pro-
cess that the connecting pin of the component is moved
in a circular motion in the bore.
If the solder has not been fully removed after the suctio-
ning process, the soldering location should be tinned
before unsoldering again.
The selection of the correct suction nozzle size is impor-
tant. Rule of thumb: internal diameter of the suction
nozzle should correspond to the diameter of the plate
bore.
If the total output of the unit is exceeded due to the con-
nected soldering tools the right channel will switch off
automatically.
External input unit WCB 1 and WCB 2 (optional)
The following functions are possible when using an
external input unit.
Offset:
The real temperature of the soldering iron can be chan-
ged by ± 40 °C by input of a temperature offset.
Setback:
Reduction of the setpoint temperature to 150 °C (stand-
by). The set backtime can be set at 0-99 minutes after the
soldering station has switched to standby mode. After a
period equal to three times the set-back time, the "Auto
Off" function is activated. The soldering iron is switched
off (flashing dash on the display).