Safety instructions / General plasma explanations / Before use
Cutting cables should be com-
pletely unwound and installed
parallel on the floor, if possible
Devices and systems at risk of
interference radiation must be
removed from the cutting area
if possible, or shielded.
• General plasma
explanations
Plasma cutters are operated
by pushing pressurised gas,
e.g. air, through a small pipe.
In the centre of the pipe, there is
a negatively charged electrode
that is directly above the noz-
zle. The vortex ring causes the
plasma to rotate quickly. If you
supply the negative electrode
with current and make the tip of
the nozzle touch the metal, this
connection creates a closed,
electrical circuit. A powerful
spark occurs between the
electrode and the metal. While
the gas flows into the pipe, the
spark heats up the gas until it has
reached the plasma condition.
This reaction causes a current
from the controlled plasma with
a temperature of 16,649 ºC
or more that moves at speed
of 6.096 m/sec and the metal
transforms into steam and molten
discharge. The plasma itself
40
GB/IE
conducts electrical current.
The working circuit that allows
the arc to occur remains as long
as current is supplied to the elec-
trode and the plasma remains
in contact with the metal to be
processed.
The cutting nozzle has a range
of further channels. These chan-
nels generate a constant flow of
protective gas around the cutting
area. The pressure of the gas
flow controls the radius of the
plasma jet.
PLEASE NOTE!
fThis machine is only designed to use
compressed air as "gas".
• Before use
• Installation environment
Make sure that working area is sufficiently
ventilated. If the device is used without
sufficient cooling, the power-on time reduces
and it can result in overheating.
Additional protection can be required for
this purpose:
The device must be free-standing with a
distance of at least 0.5 m all around.
Ventilation slots must not be blocked or
covered.
The device must not be used a storage
place and tools or other items must not
be placed on the device.