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8. Transmitter for level measurement
Specifications
Power supply U
B
Influence of power supply
Permissible residual ripple ≤ 10 % ss
Output signal
Permissible max. load R
Effect of load
Adjustability
Zero point, electrical
Scale selection
Linear error
Permissible ambient tem-
perature range
Compensated temperature
range
Temperature coefficients in the compensated temperature range
Mean TC zero point
Mean TC span
Safety-related maximum
values
Power supply U
„
i
Short-circuit current I
„
Power P
„
i
Internal capacitance C
„
Internal inductance L
„
Medium temperature
Ambient temperature
Electrical connection
Wiring protection
Ingress protection
Wiring details, 2-wire
1) Only possible within 30 seconds of connecting the supply voltage
WIKA operating instructions differential pressure gauge models 712.15.160, 732.15.160
Models 891.44 and 892.44 (Ex version)
DC 12 < U
≤ 30 V (≥ 14 V with Ex version)
B
≤ 0.1 % of full scale/10 V
4 ... 20 mA, 2-wire
for non-Ex versions, model 891.44:
A
R
≤ (U
- 12 V) / 0.02 A with R
A
B
for Ex versions, model 892.44:
R
≤ (U
- 14 V) / 0.02 A with R
A
B
≤ 0.1 % of full scale value
Adjustment of the zero point through brief bridging of terminals 5 and 6
or using the "scale selection switch" option, selectable via button
4 scales selectable via BCD switch
≤ 1.0 % of span (terminal method)
-40 ... +80 °C, -40 ... +60 °C with oxygen
-40 ... +80 °C
≤ 0.3 % of span/10 K
≤ 0.3 % of span/10 K
Ex version
DC 14 ... 30 V
≤ 100 mA
i
≤ 1 W
12 nF
i
negligible
i
-40 ... +80 °C, -40 ... +60 °C with oxygen
-40 ... +60 °C (T6)
Angular connector, 180° rotatable, wire protection, cable gland M20 x 1.5,
incl. strain relief, connection cable: Outer diameter 7 ... 13 mm, conductor
cross-section 0.14 ... 1.5 mm
Protection against reverse polarity and overvoltage
IP65 per EN/IEC 60529
Ground, connected
to case 2)
U
+/Sig
B
+0 V/Sig-
in Ohm and U
in Volt
A
B
in Ohm and U
in Volt
A
B
, temperature resistance up to 60 °C
2
Terminals 3, 4, 5 and 6: for internal use only
2) This connection must not be used
for equipotential bonding. The
instrument must be incorporated in the
equipotential bonding via the process
connection.
EN
1)
11
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