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RECOMMENDATIONS FOR USE
For soldering and desoldering
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The components and the circuit should be
cleaned and degreased.
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Preferably select a temperature below
375°C. Excess temperature may cause
the printed circuit tracks to break loose.
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The tip must be well tinned for good heat
conduction. If it has been inoperative for
any length of time, it should be retinned.
Desoldering process
Use the tip model with a larger diameter than
the pad to be desoldered, so as to achieve
maximum aspiration and thermal efficiency
1 Apply the desoldering iron tip so that the
component terminal penetrates within its
orifice.
2 When the solder liquefies, start gently to
rotate the desoldering tip so that the
component's terminal can be eased away
from the sides.
3 Press then, not before, the vacuum pump
push-button just long enough to aspirate
the solder
1
2
After pressing the desoldering key there is a
slight delay until the vacuum pump stops, this
is to make sure that the vacuum circuit is
completely empty.
If any solder remains are left on any terminal after
attempting to desolder it, resolder it with fresh
solder and repeat the desoldering operation.
Soldering iron tip replacement
Use the tip removal device Ref. 0114108.
Remove the ring to release the tip.
Remove the tip by pulling the soldering
iron lengthwise, without forcing the element.
Insert the new tip and make sure that it
has penetrated fully home.
Desoldering iron tip replacement
This operation should be done while the tip is
hot, at a minimum temperature of 250°C, so that
any tin left inside is in molten state.
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3
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a
5
Rest the desoldering iron body in the tip
removal device and unscrew the tip to be
replaced, with the aid of the spanner
supplied (Fig. a).
Insert the thickest rod inside the desolde-
ring iron body duct (Fig. b).
b
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