Weller WT 2M Mode D'emploi page 17

Equipotential bonding
a
b
c
d
Soldering and desoldering
Carry out soldering work as directed in the operating instructions of your connected soldering tool.
Handling the soldering tips
Coat the selective and tinnable soldering tip with solder
•
when heating it up for the first time. This removes oxide
coatings which have formed during storage and impurities
from the soldering tip.
Make sure that the soldering tip is well coated with solder
•
during breaks between soldering work and prior to storage
of the device.
Do not use aggressive fluxing agents.
•
Always make sure that the soldering tips are fitted properly.
•
Select as low a working temperature as possible.
•
Select the largest possible soldering tip shape for the
•
application.
Rule of thumb: the soldering tip should be roughly as large
as the soldering pad.
Coat the soldering tip well with solder to ensure that there
•
is efficient heat transfer between the soldering tip and the
Four variants are possible by connecting the 3.5 mm jack socket differently:
a Hard-grounded
b Equipotential bonding
c Floating
d Soft-grounded
supplied without plug.
with plug, equaliser at centre contact.
with plug
with plug and soldered resistor. Grounded through
selected resistor.
soldering area.
Prior to extended breaks between soldering work, switch
•
off the soldering system or use the Weller function to
reduce the temperature when the soldering equipment is
not in use.
Coat the tip with solder prior to storage if you do not intend
•
to use the soldering iron for an extended period of time.
Apply solder directly to the soldering area, not to the
•
soldering tip.
Change the soldering tips using the designated tool.
•
Do not apply mechanical force to the soldering tip.
•
Notice
The control units have been adapted to hold a
medium-sized soldering tip. Discrepancies may occur
if the tip is changed or a different shaped tip is used.
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