Achieving Equipotential Bonding With Vdl; Equipotential Bonding Between The Vdl And Vacuum Module; Equipotential Bonding Between The Condensate Collecting Tray And Vacuum Module - Binder VD Série Manuel De Montage

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6.

Achieving equipotential bonding with VDL

Equipotential bonding must always be made via external grounding connections, so that no potential
can be introduced in the event of a short circuit. Following the installation of the VDL and the vacuum
module and implementing all the measures described below to achieve equipotential bonding, we
recommend performing a protective conductor measurement before commissioning.
6.1.

Equipotential bonding between the VDL and vacuum module

The conductive connection between the VDL and the vacuum module is established by mounting the
connecting plate (chap. 3.2). Therefore, in addition to the stabilizing function, this plate also fulfills a
protective function by ensuring equipotential bonding
6.2. Equipotential bonding between the condensate collecting tray and vacu-
um module
To establish a conductive connection between the condensate collecting tray and the vacuum module,
screw the front edge of the tray on the front of the vacuum module with two supplied screws.
Position of the screws on the vacuum module size
23 / 53 / 115 with vacuum pump VP4 (MZ 2C EX)
and mounted condensate collecting tray
Mounting instructions for vacuum module10/2016
Position of the screws on the vacuum module size 115
with vacuum pump VP5 (MD 4C EX) and mounted con-
densate collecting tray
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