Cleaning And Maintenance - Velleman VTSS110 Notice D'emploi

2. Set the temperature and air flow.
• After setting the desired temperature and airflow, wait for the temperature to stabilize.
• Recommended temperature settings: 300°C ~ 350°C; recommended airflow settings: 1 ~ 3 (smallest
nozzle) or 4 ~ 6 (other nozzle types). Make sure not to set the airflow higher than 6 when using the smallest
nozzle as this can melt the plastic handle.
3. Melt the solder.
• Hold the gun in such way that the nozzle be directly over the SMD. Be careful not to touch any leads of the
SMD.
4. Remove the SMD.
• Once all solder has melted, remove the SMD.
5. Turn off the power to the unit.
• Upon switching off the unit, the automatic cooling function will start blowing air so as to cool down both the
heating element and the handle. Do not disconnect the unit from the mains during this process.
6. Remove the remaining solder.
• Clean the SMD by removing all remaining solder with desoldering braid or a desoldering tool.
NOTE: Remove SMDs, SOPs (Small-Outline Package) and PLCCs (Plastic Leaded Chip Carrier) using tweezers.
SOLDERING
1. Switch on the unit. The heater LED blinks when the temperature reaches the set temperature.
2. Apply some solder paste onto the SMD. Position the SMD onto the PCB.
3. Preheat the SMD.
4. Solder the SMD onto the PCB by heating the lead frame evenly.
5. Wash away the flux when soldering is completed.
NOTE: Be very careful not to damage the SMD when soldering. Examine soldering conditions sufficiently.
4. Replacing the Heating Element
1. Loosen the two screws which secure the tip. Remove the tip and slide out the heating element. Be careful not
to drop the quartz glass or the heating element.
2. Disconnect the terminal and remove the heating element.
3. Insert a new heating element and reconnect the terminal. Reconnect the ground wire. Handle the heating
element with great care.
4. Reassemble the handle.

5. Cleaning and Maintenance

Tip Temperature – High temperature shortens tip life and may cause thermal shocks to the components. Always use
the lowest possible temperature when soldering. The excellent thermal recovery characteristics of your
VTSS110 ensure effective soldering at low temperatures.
Cleaning – Always clean the soldering tip after use to remove any residual solder or flux. Use a clean and moist
cleaning sponge. Contaminants remaining onto the tip reduce the heat conductivity which may result in poor
soldering.
After Use – Always clean the soldering tip and coat it with a fresh layer of solder after use. This will prevent the tip
from oxidizing.
Tip Oxidation – Never allow the unit to stay idle at high temperatures for extended periods of time. Failure to do so
will make the tip prone to oxidation.
VTSS110_v2 3 VELLEMAN