With Crease Rule; Using Framelits™, Thinlits™, Triplits™ Or Wafer-Thin Dies - SIZZIX Big Shot PRO Livret D'instructions

Sliding Tray
Using Sizzix® Bigz™ Pro, Bigz XL, Bigz or Originals™ Dies

with Crease Rule*

1. Place a die on a Cutting Pad with foam side up. Place paper or desired material
to be cut on top of the die. Place the Premium Crease Pad on top of the paper
or material to create a "sandwich" (Figure C). *A Mylar Shim may be necessary;
see Troubleshooting Solutions on page 12.*
2. Place "sandwich" on top of the Adapter Pad in the Sliding Tray.
3. Follow Steps 3–5 in Operating Instructions, page 5.
Sliding Tray
Using Framelits™, Thinlits™, Triplits™ or Wafer-Thin Dies
1. Place material to be cut on top of a Cutting Pad. Align die on top of material
as desired. Place Cutting Pad on top of die to create a "sandwich" (Figure D).
2. Place "sandwich" on Big Shot™ Pro Solo Platform, Solo Shim and Solo Thin-Die
Adapter (all sold separately) and place on top of the Adapter Pad in the
Sliding Tray.
3. Follow Steps 3–5 in Operating Instructions, page 5.
"Sandwich"
Figure C
"Sandwich"
Figure D
6
Premium Crease Pad
Material
Die
Mylar Shim
Cutting Pad
Adapter Pad
Cutting Pad
Die
Paper
Cutting Pad
Solo Thin-
Die Adapter
Solo Shim
Solo Platform
Adapter Pad