Field Of Application; Preparing The Strain Gages - HBM EP 250 Instructions D'emploi

EP 250

1.2 Field of application

EP 250 is a hot curing two-component epoxy resin adhesive, consisting of the
viscous component A and the powder component B. This adhesive was spe-
cially developed for strain gage techniques. It enables full advantage to be
taken of the accuracy offered by HBM strain gages of series A, G, K and U
and can also be used without restrictions for series E strain gages and for se-
ries C and Y universal strain gages.
The adhesive bonds extremely well with all the usual metals.
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Preparing the strain gages

Strain gages supplied ex factory are in working condition and may only be
handled with tweezers.
If the strain gages have become dirty during handling, proceed as follows:
Carefully clean the adhesive side of the strain gages with a cotton bud soaked
in solvent (such as RMS1). Carefully allow any remaining solvent to evapo-
rate, using a hair dryer, if necessary.
If the strain gage has an installation aid (adhesive tape), make sure that the
adhesive film of the tape is not partly dissolved by the cotton bud and trans-
ferred to the strain gage.
In certain circumstances, series G and K strain gages may have to be
adapted to highly curved surfaces. The easiest way to achieve this is with a
heated (120...180 °C [ 248...356 °F]) model of the measuring point. With ra-
diuses of 5 to 10 mm, the strain gage can be adapted in one step; with
smaller radii, several steps should be taken. A hot air blower (plastics welder)
is also suitable for heating.
1)
The series of strain gages can be distinguished by the material of the measuring
grid carrier:
A, U = polyetheretherketone, filled;
G, K = phenolic resin with glass fiber;
C, Y = polyimide;
E = special plastic.
A1659-1.0 en/de/fr
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HBM