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Figure: Cleaning Tool, Cleaning and Replacing the
Suction Nozzle see page 87.
4. Equipotential bonding
The various circuit elements of the 3.5 mm jack bush (7)
make 4 variations possible:
Hard-grounded:
No plug (delivery form)
Equipotential bonding:
With plug, equalizer at center contact(impedance 0 ohms
Potential free:
With plug
Soft-grounded:
With plug and soldered resistance. Grounding via set resi-
stance value.
5. Instruction for Use
Different suction nozzles provide solutions for a wide range
of desoldering problems.
The correct tool for changing the suction nozzles is integra-
ted in the cleaning tool. Press lightly against the heating ele-
ment when inserting and locking the suction nozzles.
It is important to use additional solder when desoldering.
This ensures good suction nozzle wetting properties and
improves the flow characteristics of the old solder. Ensure
that the suction nozzle is perpendicular to the plane of the
circuit board to achieve optimal suction performance. The
solder must be completely molten. During the desoldering
process it is important to move the component pin in a cir-
cular motion in the hole. If, after the desoldering process, the
solder is not completely removed, the solder joint should be
retinned before desoldering again. The selection of the right
size of suction nozzle is important. As a rule of thumb: the
internal diameter of the suction nozzle should match the dia-
meter of the hole in the circuit board.
When heating the suction nozzle or soldering iron bit for the
first time, wet with solder. This removes oxide layers and
impurities that have formed during storage. Always ensure
that the soldering iron bit or suction nozzle is well tinned
during breaks in soldering and when placing in the holder.
Do not use excessively aggressive fluxes.
The desoldering station has been set up for a medium size
suction nozzle or soldering iron bit. Temperature variations
may occur if other bit shapes are used.
Important: Always ensure that the soldering iron bit is
correctly seated.
19
External input unit WCB 1 and WCB 2 (optional)
The following functions are possible when using an external
input unit.
● ● Offset:
The real temperature of the soldering iron can be changed by
± 40°C (72°F) by input of a temperature offset.
● ● Setback:
Reduction of the required temperature set to 150ºC / 300ºF
(standby). The set-back time, the time after which the solde-
ring station switches into standby mode, can be adjusted
from 0-99 minutes. The set-back condition is indicated by a
flashing actual value display. After a period equal to three
times the set-back time, „Auto-Off" is activated. The solde-
ring iron is switched off (flashing dash on the display). The
set-back or auto-off condition is ended by pressing a button
or finger switch pressure. During this process the required
value set is briefly displayed.
● ● Lock:
Locking the setpoint temperature. Settings cannot be chan-
ged after the soldering station has been locked.
● ● °C/°F:
Switching the temperature display from °C to °F, and vice
versa.
● ● Window:
Limitation of the temperature range to max. ±99 °C based on
a locked temperature resulting from the "LOCK" function.
The locked temperature represents the median point of the
adjustable temperature range. For units with a floating con-
tact (optocoupler output) the "WINDOW" function is used to
adjust a temperature window. If the actual temperature is
within the temperature window the floating contact will be
enabled (optocoupler output).
● ● Cal:
Re-adjustment of the soldering station (WCB 2 only).
● ● PC interface:
RS232 (WCB 2 only).
● ● Temp. gauge:
Integrated temperature gauge for thermal element Type K
(WCB 2 only).
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