Grinding Guide; Grinding Heads; Diamond Segments - Husqvarna PG 530 (ph 1) Manuel D'utilisation

Grinding heads

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1 Head pin
2 Drive hub
3 Silicone spring
4 Head plate
5 Head lock screw
6 Head lock
7 Head pin screw
Between the head plate and head mate are 3 white
silicone springs which give shock absorption and flexibility
in the system.

Diamond segments

The following are guidelines regarding diamond
segments grinding applications. As with all guide lines
there are always exceptions to the rule.
General
Diamond abrasives usually consist of 2 components:
• Diamond powder (also known as diamond crystals or
grit). By changing the size of the diamond powder or
grit, we can change how coarse or fine the scratches
will be that are left behind from the grinding process.
• A binding agent (metal or resin). Diamond powder is
mixed and suspended in either a metal or resin
binding agent. When suspended in a metal binding
agent, the finished product is referred to as a Metal
Bond or Sintered diamond segment. When
suspended in a resin binding agent, the finished
product is referred to as a Resin Bond diamond
segment or pad. By changing the hardness of the
binding agent, we can change how fast or slow the
diamond abrasive will wear.

GRINDING GUIDE

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Diamond grit size
The following are general rules regarding diamond
segments in grinding applications. As with all general
rules there are exceptions or cases when it is not the
case.
Changing the size of the diamond grit to a smaller particle/
grit size will effect the performance of the diamond tool in
the following ways:
• Create a finer scratch pattern.
• Increase life of diamond tool.
The opposite will occur when changing to a larger
particle/grit size.
Binding agent
Increasing hardness of bond will:
• Create a finer scratch pattern.
• Increase life of diamond tool.
• Decrease production rate.
The opposite will occur when making the metal or resin
bond softer.
Number of diamond segments under the
machine
Increasing the number of segments under the machine
will:
• Reduce pressure on each individual diamond
segment - reduce wear rate on diamond segments.
• Reduce load on the machine and cause the grinder to
draw less current.
• Create a smoother scratch pattern (particularly on soft
floors).
The opposite will occur when decreasing the number of
segments under the machine.
Wet and dry grinding
When using diamond segments wet, the following
principles apply:
• Production rates will be higher than dry grinding.
• Diamond segments will wear faster (due to presence
of slurry) and therefore, harder bonds can be used
(when comparing with dry grinding).
• Scratches from diamond grit will be deeper.
When using diamond segments dry, the following
principles apply:
• Production rates will be slower on harder materials
than if wet grinding.
• Softer bond segments will be required in order to
encourage segment wear (as there will be not slurry to
help diamond segments to wear).
• Scratches from diamond grit will not be as deep
compared to if it were also used for wet grinding.
• There will be more heat generated by the diamond
segment.
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English 9