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IC Package
Application
1. Suitable for desoldering multiple components.
2. Ideal for heating shrink, viscidity removal, lacquer removal, preheating and
more.
Operation Instruction
1. Set the heat nozzle (large caliber nozzle is preferred).
2. Switch the power on. The screen will display "SLP", this represents standby
mode.
3. Press "▲"or "▼"button to adjust the temperature.
4. Adjust the airflow knob to set up the required air volume. Operate normally
when the temperature is stable.
5. Put the handle back on the holder once you have finished using. Once the
temperature falls below 100℃, the station will switch to standby mode.
6. Once the rework station has cooled, switch the power off and unplug the
power cord.
Attention
Please set the temperature as low as possible when using the high airflow
volume to prolong the heating element service life and IC chips protection.
Setting up Temperature
1. Press "▲"or "▼"button to set up the temperature. The screen will display the
selected temperature.
2. By pressing "▲" once, the temperature will increase 1℃, (the screen will
reflect this).
3. By pressing "▼" once, the temperature will decrease 1℃, (the screen will
reflect this).
4. When pressing the "▲"or "▼" button continuously, the temperature will
increase or decrease rapidly.
ID (mm)
Ø 4.3
Ø 7.4
Ø 11.2
EN-4
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