ASROCK B560M-HDV/M.2 Manuel Utilisateur page 7

1.2 Specifications
Platform
CPU
Chipset
Memory
Expansion
Slot
6
• Micro ATX Form Factor
• Solid Capacitor design
th
• Supports 10 Gen Intel® Core
TM
Intel® Core Processors (LGA1200)
• 5 Power Phase design
• Supports Intel® Turbo Boost Max 3.0 Technology
• Intel® B560
• Dual Channel DDR4 Memory Technology
• 2 x DDR4 DIMM Slots
th TM
• 11 Gen Intel® Core
un-buffered memory up to 4000+(OC)*
th TM
• 10 Gen Intel® Core
un-buffered memory up to 3600+(OC)*
th TM
* 11 Gen Intel® Core
TM
3200(OC); Core (i3), Pentium® and Celeron® support DDR4 up
to 2666.
th TM
* 10 Gen Intel® Core
TM
Core (i5/i3), Pentium® and Celeron® support DDR4 up to 2666.
* Please refer to Memory Support List on ASRock's website for
more information. (http://www.asrock.com/)
• Supports ECC UDIMM memory modules (operate in non-
ECC mode)
• Max. capacity of system memory: 64GB
• Supports Intel® Extreme Memory Profile (XMP) 2.0
th TM
11 Gen Intel® Core Processors
• 1 x PCI Express 4.0 x16 Slot*
th TM
10 Gen Intel® Core Processors
• 1 x PCI Express 3.0 x16 Slot*
* Supports NVMe SSD as boot disks
• 1 x PCI Express 3.0 x1 Slot
TM
Processors and 11
Processors support DDR4 non-ECC,
Processors support DDR4 non-ECC,
(i9/i7/i5) support DDR4 up to
(i9/i7) support DDR4 up to 2933;
th
Gen