Table des Matières
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TABLE OF CONTENTS
1.
2.
Location and Function of Controls ................................. 4
Operation ......................................................................... 6
Installation ....................................................................... 8
Connections ..................................................................... 9
3.
......................................................... 10
4.
5.
6.
7.
7-1. Block Diagram - SERVO Section - .............................. 21
7-2. Block Diagram - MAIN Section - ................................ 22
Schematic Diagrams ....................................................... 23
7-4. Printed Wiring Boards - RF/LSW Boards - ................. 24
7-5. Schematic Diagram - RF/LSW Boards - ...................... 25
- MAIN Board (Component Side) - .............................. 26
- MAIN (Conductor Side)/SW Boards - ....................... 27
7-8. Schematic Diagram - MAIN Board (1/2) - .................. 28
7-9. Schematic Diagram - MAIN (2/2)/SW Boards - ......... 29
7-10. Printed Wiring Boards - FM Board - ............................ 30
7-11. Schematic Diagram - FM Board - ................................. 31
7-12. IC Pin Function Description ........................................... 35
8.
9.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED
LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
2
................................................ 3
................... 16
.......................... 18
.......................................... 19
................................................ 37
............................... 43
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0
SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE
DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ
DE FONCTIONNEMENT. NE REMPLACER CES COM-
POSANTS QUE PAR DES PIÈCES SONY DONT LES
NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
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