Table Des Matières; Sommaire - Fluke Process Instruments RayTek MI3 Serie Manuel D'utilisation

DECLARATION DE CONFORMITE .............................................................................................................. 5
SOMMAIRE ......................................................................................................................................................... 6
1 CONSIGNES DE SECURITE ....................................................................................................................... 11
2 DESCRIPTION ............................................................................................................................................... 12
2.1 V '
UE D ENSEMBLE
3 DONNEES TECHNIQUES ........................................................................................................................... 14
3.1 S
PECIFICATIONS DE MESURE
3.1.1 Tête ..................................................................................................................................................... 14
3.1.2 Boîtier de communication ................................................................................................................... 15
3.1.2.1 Boîtier de communication (métal) ............................................................................................................ 15
3.1.2.2 Boîtier de communication (DIN) .............................................................................................................. 15
3.2 S
PECIFICATIONS OPTIQUES
3.3 S
PECIFICATIONS ELECTRIQUES
3.3.1 Boîtier de communication, tous les modèles ....................................................................................... 17
3.3.2 Boîtier de communication (métal) ....................................................................................................... 17
3.3.3 Boîtier de communication (DIN 6TE, analogiques) ........................................................................... 17
3.4 S
PECIFICATIONS ENVIRONNEMENTALES
3.4.1 Tête ..................................................................................................................................................... 18
3.4.2 Boîtier de communication (métal) ....................................................................................................... 18
3.4.3 Boîtier de communication (DIN) ........................................................................................................ 18
3.4.4 Électronique LTH ............................................................................................................................... 19
3.5 D ··············································································································································· 19
IMENSIONS
3.5.1 Tête LT, G5 ......................................................................................................................................... 19
3.5.2 Tête LTH ............................................................................................................................................. 19
3.5.3 Tête 1M, 2M ....................................................................................................................................... 20
3.5.4 Boîtier de communication (métal) ....................................................................................................... 20
3.5.5 Boîtier de communication sur rail (DIN) ........................................................................................... 21
3.6 F ············································································································································· 21
OURNITURES
3.6.1 Tête ..................................................................................................................................................... 21
3.6.2 Boîtier de communication ................................................................................................................... 21
4 PRINCIPES ...................................................................................................................................................... 22
4.1 M
ESURE DE TEMPERATURE PAR INFRAROUGE
4.2 E '
MISSIVITE DE L OBJET DE MESURE
4.3 T
EMPERATURE AMBIANTE
4.4 Q '
UALITE DE L ATMOSPHERE
4.5 I
NTERFERENCES ELECTRIQUES
5 INSTALLATION ............................................................................................................................................ 24
5.1 P
OSITIONNEMENT
5.1.1 Distance et taille du spot .................................................................................................................... 24
5.2 C
ONFIGURATION
5.2.1 Boîtier de communication (métal) ....................................................................................................... 24
5.2.2 Boîtier de communication (DIN) ........................................................................................................ 25
5.3 C
ABLE DE LA TETE DE MESURE
5.3.1 Boîtier de communication (métal) ....................................................................................................... 26

Sommaire

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