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4-2. Mounting Method
PCB type
Please use the mounting holes (5 holes of f3.5) and insert the
spacer (MAXf8.0)of height over 8mm to lift the unit. Also use
all 5 mounting holes for the unit installation. The vibration test
is taken when the unit is raised by 8mm spacers.
Please leave 4.5mm space from the unit surfaces and leave
4.5mm space from the sides of PCB. For the solder surface,
8mm space is necessary. If the space is not enough, the
specification for insulation and withstand voltage will not be
satisfied.
PE should be connected to the earth terminal of the apparatus.
If not, the EMI noise and output noise will increase.
PE
Hatching area is maximum permissible area of metal
part for mounting.
For chassis option /L, chassis & cover option /A
Recommended mounting by following holes A or B, to meet
2
19.6m/s
vibration specification. Mounting direction (F) & (G)
is prohibited as shown in section 4-1.
A: Embossed tapped and countersunk holes by 4-M4 screws
B: F4.5 holes and R2.25 slot hole by 3-M4 screws
Mounting (F), (G), (H), (I) is prohibited.
For mounting method (J), (K), (L), below, the vibration speci-
2
fication is 4.9m/s
, mounted through holes C or D.
Note: Output derating for mounting (J) is same as mounting
(C). Output derating for mounting (K) is same as
mounting (E). Output derating for mounting (L) is
same as mounting (D).
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TDK-Lambda
ZWD150PAF Series
INSTRUCTION MANUAL
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