Minimum air velocity: 1.5m/s ( Measured at components side of PCB, and air must flow through components side ).
MODEL: CUS200M-12, CUS200M-18, CUS200M-24, CUS200M-48
120
100
80
60
40
20
5-3. Mounting Method
Insert the spacer (Maxφ7mm) of height more than 8mm to lift the unit. And use all mounting holes for the unit installation. The vibration
spec is specified under this mounting condition. Keep enough space in the power supply surroundings and the upper area of components for
convection cooling
(1)
Mounting Holes size: 4 holesφ3.5mm.
(2)
Conditions to meet Isolation and Withstanding Voltage standard.
Keep 5mm space from the surfaces and sides of PCB. Especially, 8mm space is necessary from the solder surface. If the space is not
enough, the specification of isolation or withstanding voltage will not be satisfied.
.
Ta (°C)
-20 - +50
0
-20
-10
0
10
LOAD (%)
100
60
75
50
70
20
30
40
Ta (°C)
- 8 -
TDK-Lambda
CUS200M
Instruction Manual
50
60
70
80