Figure 1 DSB generation ................................................................................................................................................ 7
Figure 3 MDT Block diagram ....................................................................................................................................... 9
Figure 4 Carrier oscillator .......................................................................................................................................... 14
Figure 5 Mixer ................................................................................................................................................................. 15
Figure 6 Microphone Amplifier ............................................................................................................................... 16
Figure 7 Transmit .......................................................................................................................................................... 17
Figure 8 Receive Audio ................................................................................................................................................ 18
Figure 9 Diode identification .................................................................................................................................... 25
Figure 10 DIP ICs ........................................................................................................................................................... 25
Figure 11 Relay install ................................................................................................................................................. 26
Figure 13 LPF capacitor marking ............................................................................................................................ 27
Figure 15 BD139 location .......................................................................................................................................... 28
Figure 17 LED lead bending ...................................................................................................................................... 30
Figure 18 LED install .................................................................................................................................................... 30
Figure 19 Pot with tab removed .............................................................................................................................. 35
Figure 20 Component overlay .................................................................................................................................. 36
Figure 21 Mic connector wiring .............................................................................................................................. 37
Figure 22 Typical circuit voltages. .......................................................................................................................... 43
Figure 23 DSB transmit waveform ......................................................................................................................... 48
Date
Issue
12-6-15
1
20-6-15
2
12-1-16
3
02-08-16
4
MDT Construction Manual - Issue 4
List of Figures
Change History
First release
Correction des valeurs R43 C13 et autres quelques fautes.
Résonateur céramique en option supplémentaire détails
C51 ajouté à la liste des pièces. Corrigé Q3 dans la liste des pièces. Q9
inclus dans la construction.
Comments
Page 3