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7. Remove outer (overall) shield from the
conductor bundle making sure not to
damage the inner shields (Figure 7).
8. Remove ller materials making sure
not to disturb/damage inner shields
(Figure 8).
SECTION 3: USING LIQUID-TYPE SEALING COMPOUND SC4-KIT-1
Suitable for use on all power cables and shielded data cables
1a. Pack the ber damming material tightly
into all voids between conductors and
body and spread strands of uninsulated
grounding conductor, where applicable
(Figure 1a).
2a.Screw the sealing chamber back on the
body subassembly until it completely
seats on the body (Figure 2a).
3a. Position cable/ tting into a vertical
position.
NOTE:
For ttings up to and including STX250-476, use Method A.
For ttings STX300-478 and up, use Method B.
A. Mix sealing compound following instructions provided on the
compound package. Dispense sealing compound into end of sealing
chamber until level of compound stabilizes. Fill to the top (Figure 3a).
B. Mix sealing compound following instructions provided on the
compound package. Dispense sealing compound into end of sealing
chamber until level of compound stabilizes. Fill approximately HALF of
the sealing chamber. Wait 2 hours and ll the rest of the sealing
chamber to the top (Figure 3a).
CAUTION: REMOVE ALL EXCESS COMPOUND MATERIAL FROM
OUTSIDE OF SEALING CHAMBER WITH DAMP CLOTH. DO NOT USE
ANY ABRASIVE CLEANERS SUCH AS POWDER CLEANERS, SAND
PAPER, STEEL WOOL OR WIRE BRUSH THAT MAY DAMAGE THE
FLAME PATH.
4a. Mount hub in desired location. When
the sealing compound is solidifed (after
approximately 1 hour), place
encapsulated assembly into hub and
secure in position by tightening union
until it bottoms (metal to metal contact)
(Figures 4a and 5a).
Figure 7
Figure 1a
Figure 4a
Figure 8
Figure 2a
Figure 3a
Figure 5a
IN ORDER TO
SPREAD THE
COMPOUND INTO
ALL AREAS,
SEPARATE ALL
CONDUCTORS.
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