Operating Information - SURTECO Döllken Profiles HKP 2.0 E Mode D'emploi

Operation
5. Push the hot-melt adhesive candle to the opening in the rear of the
device.
6. Insert a new glue stick when the red LED glue stick slot (8) lights up.
3.3 Setting the stroke limit
The left side of the supporting foot has a switch (4) for adjusting the hot melt
adhesive delivery rate.
• Switch setting „+" for continuous glueing with maximum throughput of hot
melt adhesive.
• Switch setting „-" for small areas, particularly precise glueing with low
throughput of hot melt adhesive.
Fig. 1:
3.4

Operating information

Please observe the supplied Döllken instructions for hot-melt adhesive to
ensure perfect adhesive application.
• Surfaces to be glued should be be acclimatized to at least 18 °C and free
of dust, grease and moisture. Remainders of wax, separating oils, plasticiz-
ers or impregnation media on the workpieces can lead to loosening of the
adhesion immediately or later.
• For optimum glueing, the adhesive must be applied evenly, continuously
and in sufficient quantity.
• Never extract the old adhesive candle from the device. Protruding sticks
must be cut off and reused later.
3.5 Breaks/end of work
Turn the device off at the power switch (6) if you do not require any adhesive
for longer than 20 minutes.
The adhesive can remain in the device and be remelted later on.
Switch
12
GB