1. Adjust air flow and heat gun temperature to desired level
2. Slip the pick-up puller (not included
in kit) under the component lead.
(Fig. 4) If the width of the
component does not match the size
of the pick-up, adjust the width of
the pick-up by squeezing the wire.
In case of PLCC or small
components such as chip resistors, desolder by using tweezers, etc.
3. Hold the heat gun up on the SMD components, but do not touch the
components, and allow the hot air to melt the solder. Be careful not to
touch the leads of the components with nozzle.
4. When the soldering tin is melted, remove the SMD components by
lifting the pick up puller (Fig. 5)
5. After removing SMD components, remove residual soldering solder tin
with desoldering tool.
●SMD rework operation instructions
1. Apply proper quantity of solder paste and install the SMD components
on PCB.
2. Preheat the components as per Fig. 6
Fig. 5
Fig. 6
Fig. 4
EN-6